Facility & Capability
Our production plants are equipped with state of the art as well as customized manufacturing equipment suited for manufacturing products to customer requirements with the highest productivity and minimal fall out rates.
We are engaged in manufacturing prototypes through a dedicated NPI process thereafter being handed over to the mass production teams. We service our customers’ high mix/low volume requirements as well as medium to high volume production batches.
Our highly flexible set up; dedicated work force and customer focused manufacturing teams make us a preferred destination, customers are most comfortable placing their manufacturing requirements with us since we work as their extended factories with the most transparent systems with the help of our ERP system SAP B1.
Through our state of the art production equipment we can assemble extremely dense and miniature packages for a range of high mix and mixed technology PCBA’s. We currently build assemblies with 01005 chip packages, BGA’s, uBGA’s, Double Side SMT with glue dispensing and can handle various IC packages such as QFP, QFN, DFN, TSSOP, MSOP, TQFP, Package on Package, PBGA’s, etc. Besides electronic assemblies we provide complete box build solutions and system assemblies with all types of wire harnesses, sheet metal parts, plastic injection moulded and precision parts.
Our PCB plants are equipped with fully automated and semi-automated equipment to produce the most complex PCB requirements. We manufacture S/S, Metal Core, D/S, 4L, 6L, 8L and 10L PCB’s with all types of board finishes such as Immersion Gold, Tab Gold/Gold Fingers, Lead Free HASL, Tin Lead HASL and OSP. Being an extremely flexible production house suiting our customers’ requirements we use all types of Solder Mask colors such as Blue, Red, Black, White and standard Green Mask.